1 radiation hardened quad differential line drivers hs-26ct31rh, hs-26ct31eh the intersil hs-26ct31rh, hs-26ct31eh are quad differential line drivers designed for digi tal data transmission over balanced lines and meet the requirements of eia standard rs-422. radiation hardened cm os processing assures low power consumption, high speed, and reliable operation in the most severe radiation environments. the hs-26ct31rh, hs-26ct31eh accept ttl signal levels and convert them to rs-422 compatib le outputs. these circuits use special outputs that enable the drivers to power down without loading down the bus. enable and disable pins allow several devices to be connected to the same data source and addressed independently. specifications specifications for rad hard qml devices are controlled by the defense logistics agency land and maritime (dla). the smd numbers listed here must be used when ordering. detailed electrical specifications for these devices are contained in smd 5962-95632. a ?hot-link? is provided on our homepage for downloading. http://www.landandmaritime.dla.mil/downloads/milspec/s md/95632.pdf features ? electronically screened to smd #5962-95632 ? qml qualified per mil-prf-38535 requirements ? 1.2 micron radiation hardened cmos ? total dose up to 300krad(si) ?latchup free ? eia rs-422 compatible outputs (except for ios) ? operation with ttl based on v ih = v dd /2 ? high impedance outputs when disabled or powered down ? low power dissipation 2.75mw standby (max) ? single 5v supply ?low output impedance 10 or less ? full -55c to +125c military temperature range applications ? line transmitter for mil-std-1553 serial data bus ? line transmitter for rs422 ordering information ordering number internal mkt. number part marking temp. range (c) package pkg. dwg. # 5962f9563201qec hs1-26ct31rh-8 q 5962f95 63201qec -55 to +125 16 ld sbdip d16.3 5962f9563201qxc hs9-26ct31rh-8 q 5962f95 63201qxc -55 to +125 16 ld flatpack k16.a 5962f9563201vec hs1-26ct31rh-q q 5962f95 63201vec -55 to +125 16 ld sbdip d16.3 5962f9563201vxc hs9-26ct31rh-q q 5962f95 63201vxc -55 to +125 16 ld flatpack k16.a hs1-26ct31rh/proto hs1-26ct31rh/proto hs1 - 26ct31rh /proto -55 to +125 16 ld sbdip d16.3 hs9-26ct31rh/proto hs9-26ct31rh/proto hs9 - 26ct3 1rh /proto -55 to +125 16 ld flatpack k16.a 5962f9563201v9a hs0-26ct31rh-q -55 to +125 5962f9563202vxc hs9-26ct31eh-q q 5962f95 63202vxc -55 to +125 16 ld flatpack k16.a caution: these devices are sensitive to electrostatic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | copyright intersil americas inc. 2000, 2008, 2012. all rights reserved intersil (and design) is a trademark owned by intersil corporation or one of its subsidiaries. satellite applications flow ? (saf) is a trademark of intersil corporation. all other trademarks mentioned are the property of their respective owners. february 23, 2012 fn2929.4
hs-26ct31rh, hs-26ct31eh 2 fn2929.4 february 23, 2012 pin configurations hs1-26ct31rh (16 ld sbdip) cdip2-t16 top view hs9-26ct31rh, hs-26ct31eh (16 ld flatpack) cdfp4-f16 top view logic diagram 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 ain ao ao enable bo bo gnd bin vdd do do enable co co cin din ain ao ao enable bo bo bin gnd 2 3 4 5 6 7 8 116 15 14 13 12 11 10 9 vdd din do do enable co co cin enable enable ain ao bin bo cin co din do do co bo ao
hs-26ct31rh, hs-26ct31eh 3 fn2929.4 february 23, 2012 die characteristics die dimensions: 96.5 milx195 milsx21 mils (2450x4950) interface materials: glassivation: type: psg (phosphorus silicon glass) thickness: 10k ? 1k ? metallization: m1: mo/tiw thickness: 5800 ? m2: al/si/cu (top) thickness: 10k ? 1k ? substrate: avlsi1ra backside finish: silicon assembly related information: substrate potential (powered up): v dd additional information: worst case current density: <2.0x10 5 a/cm 2 bond pad size: 110mx100m
hs-26ct31rh, hs-26ct31eh 4 intersil products are manufactured, assembled and tested utilizing iso9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality intersil products are sold by description only. intersil corporat ion reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnished by intersil is believed to be accurate and reliable. however, no responsi bility is assumed by intersil or its subsid iaries for its use; nor for any infringem ents of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of i ntersil or its subsidiaries. for information regarding intersil corporation and its products, see www.intersil.com fn2929.4 february 23, 2012 for additional products, see www.intersil.com/product_tree metallization mask layout hs26ct31rh, hs-26ct31eh (14) do (13) do (12) enable (11) co (10) co ao (2) ao (3) enable (4) bo (5) bo (6) bin (7) gnd (8) cin (9) gnd (8) (1) ain (16) vdd (15) din (16) vdd
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